Pulsed heated hot bar reflow soldering is soldering robot through which two solder plated parts are pressed together and heated to some temperature adequate to cause the solder to melt and flow, and after that the various components are cooled to create a permanent electro-mechanical bond. Pulsed heated soldering is different from traditional soldering since the reflow of solder is accomplished employing a heating element referred to as a “thermode” which can be quickly heated then cooled off for each and every connection resulting in strong joints. Pressure is applied through the entire entire cycle resulting in precise positioning. Furthermore, it makes the process suitable for parts that may otherwise disconnect during cool down. Hot bar reflow soldering is also a good choice for applications that need multiple connections being made simultaneously; up to 200 leads or wires can be connected in one process cycle. Hot bar reflow soldering processes are reproducible, quantifiable, and traceable to quality standards for example ISO / NIST. Hot Bar reflow soldering remains safe and secure, highly operator-independent and easy to automate.
Heat seal bonding – also called ACF bonding – is the method of producing electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils with very fine pitch (<30 micron). The essential characteristics of pulse heat bonding machine are heating and cooling of the adhesive under pressure.
Heatstaking is a method of joining two or more parts, where at least one is made out of plastic. The bond is made by partially de-forming the plastic part to fix the other. Heatstaking is the most efficient way to bond metal to plastic, and is commonly used in high volume/low cost applications in the automotive, telecom and 16dexgpky industries. The process works by heating the plastic to a temperature above the glass transition temperature via the use of super-heated air or a thermode, and then applying pressure in order to deform it and create the stake. The plastic is then cooled down again – under constant pressure – below the glass transition temperature, ensuring good fixation of the parts. This cooling can be done with compressed air if using a thermode, or with a cold, preformed tool if super-heated air is used.
Amada Miyachi offers a full line of robotic soldering equipment, bonding heads for benchtop use or for integration or automation, thermodes, and both standard and custom systems for reflow soldering, heat seal bonding and heat staking.